Stress-Induced Phenomena in Metallization: 11th International Workshop (AIP Conference Proceedings / Materials Physics and Applications) - quixoticals.com
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Series: AIP Conference Proceedings / AIP Conference Proceedings Stress-Induced Phenomena Metallizat. Book 305 Hardcover: 302 pages; Publisher: American Institute of Physics; 1994 edition April 14, 1994 Language: English; ISBN-10: 1563962519; ISBN-13: 978-1563962516; Product Dimensions: 6.1 x 0.8 x 9.2 inches Shipping Weight: 1.3 pounds. Apr 14, 2010 · Stress-induced phenomena in metallization: Eleventh International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12-14 April 2010. AIP Conference Proceedings No. 236 1991 ISBN 0-88318-873-2. 13. Stress-Induced Phenomena in Metallization: First International Workshop. Ithaca, NY, 1991. Editors: Che-Yu Li, Paul Totta, and Paul Ho. AIP Conference Proceedings No. 263 1992 ISBN 1-56396-082-6 Back. Paul S. Ho, Shinichi Ogawa, and Ehrenfried Zschech, “Stress-Induced Phenomena in Metallization”, Conference Proceedings of the Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, November 5-7, 2008. AIP Conference Proceedings, Volume 1143, 2009.

Conference: 11th International Workshop on Stress-Induced Phenomena in Metallization, Volume: 1300, pp. 114-119. January 2010 · AIP Conference Proceedings. CP1143, Stress-Induced Phenomena in Metallization: lfh International Workshop, edited by P. S. Ho, S. Ogawa, andE. Zschech Zschech C 2009 American Institute of Physics 978-0. Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 2004. R. Huang, Z. Suo, Morphological instability of solid-on-liquid thin film structures. MRS Symposium Proceedings. Sep 26, 2018 · Guo, in Proc. 11th SNEC International Solar Energy and Green Building Conference Shanghai, China, 2017. of approximately 5 × 10 −4 Ω.cm 2 and p-type emitter paste 18 18. S. S. Fritz, J. Engelhardt, S. Ebert, and G. Hahn, Physica Status Solidi RRL C Rapid Research Letters 10, 305. of approximately 4 × 10 −3 Ω. cm 2.

Aug 04, 2015 · Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 2004. R. Huang, D.W. Gan, P.S. Ho, Isothermal stress relaxation in electroplated Cu films. Part II: Kinetic modeling. J. Applied Physics 97, 103532 2005. AIP Conference Proceedings, Materials Physics and Applicat 1297. 2011 ISBN 978-0-7354-0851-7. Workshop AIP Conference Proceedings, Astronomy and Astrophysics 1273. 2011. Zschech Eds, Stress-Induced Phenomena in Metallization AIP Conference Proceedings, Materials Physics and Applicat 1300. 2010. P.S. Ho, C.A. Volkert, T. Nakamura, S.P. Baker, “Stress-Induced Phenomena in Metallization,” proceedings of the Seventh International Workshop on Stress-Induced Phenomena in Metallization, held at the University of Texas, Austin, Texas, 14-16 June 2004 AIP Conference Proceedings volume 742, American Institute of Physics, Melville, NY 2004. STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop. NUCLEAR PHYSICS AND APPLICATIONS: Proceedings of the First Ulaanbaatar Conference on Nuclear Physics and Applications. MAGNETIC MATERIALS: International Conference on Magnetic Materials ICMM-2007.

Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias Suk-Kyu Ryua, Kuan-Hsun Lub, Xuefeng Zhangb,c, Jay Imb, Paul S. Hob and Rui Huanga aDept. of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, TX 78712 bMicroelectronics Research Center, University of Texas, Austin, TX 78712 cAdvanced Micro Devices, 7171 Southwest. Stress-Induced Phenomena in Metallization 11th International Workshop AIP Conference Proceedings Vol. 1300 Z16000 Metallic Materials 978-94-007-0909-6 Kaiser Trends in Teaching and Learning of Mathematical Modelling ICTMA14 O25000 Mathematics Education 978-3-642-17809-2 Hraskó Basic Relativity An Introductory Essay SpringerBriefs in Physics. Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 2004. S.H. Im and R. Huang, Ratcheting-induced wrinkling of an elastic film on a metal layer under cyclic temperatures. Stress-Induced Phenomena in Metallization: Eighth International Workshop on Stress-Induced Phenomena in Metallization AIP Conference Proceedings /. Stress-Induced Phenomena Metallizat. [Zschech, Ehrenfried, Maex, Karen, Ho, Paul S., Kawasaki, Hisao, Nakamura, Tomoji] on. FREE shipping on qualifying offers. Stress-Induced Phenomena in Metallization: Eighth International.

STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop. AIP Conference Proceedings: Preface. Tenth International Workshop on Stress-Induced Phenomena in Metallization. Stress-Induced Phenomena in Metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization AIP Conference Proceedings /. Stress-Induced Phenomena Metallizat. [Ho, Paul S., Baker, Shefford P., Nakamura, Tomoji, Volkert, Cynthia A.] on. FREE shipping on qualifying offers. Stress-Induced Phenomena in Metallization: Seventh International Workshop. Jan 25, 2013 · Proceedings AIP Conference, Characterization and Metrology for ULSI Technology 2005, American Institute of Physics, Melville, NY 2005, p. 507. Google Scholar. AIP Conference Proceedings: 11th International Workshop on Stress-induced Phenomena in Metallization, vol. 1300 2010, p. 33. US7078817B2 US11/010,596 US1059604A US7078817B2 US 7078817 B2 US7078817 B2 US 7078817B2 US 1059604 A US1059604 A US 1059604A US 7078817 B2 US7078817 B2 US 7078817B2 Authority US United States Prior art keywords copper vias plurality groove integrated circuit Prior art date 2002-10-15 Legal status The legal status is an assumption and is not a legal conclusion.

Apr 06, 2007 · Stress-induced phenomena in metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4-6 April 2007.

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