Stress-Induced Phenomena in Metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization (AIP Conference Proceedings / Materials Physics and Applications) - quixoticals.com
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These proceedings represent papers presented at the Second International Workshop on Stress Induced Phenomena in Metallization held on March 29-31, 1993 at the University of Texas at Austin, U.S.A. The papers included in this volume discuss stress-induced void formation and electromigration failures in narrow-line inter-connect metallization. Apr 06, 2007 · Stress-induced phenomena in metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4-6 April 2007. Get this from a library! Stress induced phenomena in metallization: fifth international workshop, Stuttgart, Germany, June, 1999. [Oliver Kraft;].

The Kyoto Workshop continued the spirit of the stress workshop series to focus on current research relating to stress-induced phenomena in metallization. This workshop was held at a time when. Stress-Induced Delamination Of Through Silicon Via Structures Suk-Kyu Ryua, Kuan-Hsun Lub, Jay Imb, Rui Huanga and Paul S. Hob aDepartment of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, TX 78712, USA bMicroelectronics Research Center, University of Texas, Austin, TX 78712, USA Abstract. Continuous scaling of on-chip wiring structures has brought. Paul S. Ho, Shinichi Ogawa, and Ehrenfried Zschech, “Stress-Induced Phenomena in Metallization”, Conference Proceedings of the Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, November 5-7, 2008. AIP Conference Proceedings, Volume 1143, 2009. Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 2004. S.H. Im and R. Huang, Ratcheting-induced wrinkling of an elastic film on a metal layer under cyclic temperatures.

Aug 04, 2015 · Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 2004. R. Huang, D.W. Gan, P.S. Ho, Isothermal stress relaxation in electroplated Cu films. Part II: Kinetic modeling. J. Applied Physics 97, 103532 2005. Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 2004. R. Huang, Z. Suo, Morphological instability of solid-on-liquid thin film structures. MRS Symposium Proceedings. Stress induced phenomena in metallization: fourth international workshop, Tokyo, Japan, June, 1997. Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias Suk-Kyu Ryua, Kuan-Hsun Lub, Xuefeng Zhangb,c, Jay Imb, Paul S. Hob and Rui Huanga aDept. of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, TX 78712 bMicroelectronics Research Center, University of Texas, Austin, TX 78712 cAdvanced Micro Devices, 7171 Southwest.

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