Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization (AIP Conference Proceedings / Materials Physics and Applications) - quixoticals.com
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These proceedings represent papers presented at the Second International Workshop on Stress Induced Phenomena in Metallization held on March 29-31, 1993 at the University of Texas at Austin, U.S.A. The papers included in this volume discuss stress-induced void formation and electromigration failures in narrow-line inter-connect metallization.
Get this from a library! Stress-induced phenomena in metallization: tenth International Workshop on Stress-Induced Phenomena in Metallization: Austin, Texas, 5-7 November 2008. [P S Ho; Shinichi Ogawa; Ehrenfried Zschech;] -- "A number of papers reported results on electromigration and stress-induced void formation in copper low k interconnects using state-of-the-art methods including in. Get this from a library! Stress-induced phenomena in metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4-6 April 2007. [Shinichi Ogawa; P S Ho; Ehrenfried Zschech;]. Apr 14, 2010 · Get this from a library! Stress-induced phenomena in metallization: Eleventh International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12-14 April 2010. [Ehrenfried Zschech; P S Ho; Shinichi Ogawa;]. COVID-19 Resources. Reliable information about the coronavirus COVID-19 is available from the World Health Organization current situation, international travel.Numerous and frequently-updated resource results are available from thissearch.OCLC’s WebJunction has pulled together information and resources to assist library staff as they consider how to handle coronavirus.

The Kyoto Workshop continued the spirit of the stress workshop series to focus on current research relating to stress-induced phenomena in metallization. This workshop was held at a time when. Stress-Induced Delamination Of Through Silicon Via Structures Suk-Kyu Ryua, Kuan-Hsun Lub, Jay Imb, Rui Huanga and Paul S. Hob aDepartment of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, TX 78712, USA bMicroelectronics Research Center, University of Texas, Austin, TX 78712, USA Abstract. Continuous scaling of on-chip wiring structures has brought.

Paul S. Ho, Shinichi Ogawa, and Ehrenfried Zschech, “Stress-Induced Phenomena in Metallization”, Conference Proceedings of the Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, November 5-7, 2008. AIP Conference Proceedings, Volume 1143, 2009. Aug 04, 2015 · Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 2004. R. Huang, D.W. Gan, P.S. Ho, Isothermal stress relaxation in electroplated Cu films. Part II: Kinetic modeling. J. Applied Physics 97, 103532 2005. CP1143, Stress-Induced Phenomena in Metallization: lfh International Workshop, edited by P. S. Ho, S. Ogawa, andE. Zschech Zschech C 2009 American Institute of Physics 978-0. Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. AIP Conference Proceedings 741, 256-267 2004. S.H. Im and R. Huang, Ratcheting-induced wrinkling of an elastic film on a metal layer under cyclic temperatures.

Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization (AIP Conference Proceedings / Materials Physics and Applications)

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